
Products
Machines and materials for assembly, coating and cleaning of printed circuit boards
The most frequently ordered are:

NP545
KESTER NP545 is a lead-free No Clean solder paste with a wide range of applications. Available in particle sizes 15-25 µm (Class 5), 20-38 µm (Class 4) and 25-45 µm (Class 3). Delivered in 500gr. jars or 600gr. cartridges.
Solder paste
Kester

959T
Kester 959T is a no-clean, non-corrosive, liquid flux with low solids content that is designed for wave soldering of trough hole and surface mount circuit board assemblies. Delivered in 25l cans.
Flux
Kester

TOPKLEAN EL 606
TOPKLEAN EL 606 is especially designed to clean stencils and misprinted PCB’s from unsoldered paste in automatic cleaning machines. Delivered in 20L tube.
Cleaning chemicals
INVENTEC

YRP10e
Automatic, inline high-performance stencil printer. It operates with the YRP10’s speed (6 second cycle) and 3S (swing single squeegee) print head technology while offering ±30 µm printing accuracy at 6σ, Cpk ≥ 2.0 and maintains a compact footprint.
Printers
YAMAHA

YRM20
Automatic inline P+P machine for high volume production with up to 128 feeders and max. speed of 115 000 cph (IPC 9850).
Pick & Place
YAMAHA

1707 MK7
Heller 1707 MK7 is one of the most popular models from the MK7 family featuring lowest consumption of electrical energy, shortest time for profile changeover and overall lower oven height with 16 cm. The 1707 MK7 is an inline reflow oven for medium volume production with 7 Top and 7 Bottom heating zones as well as 1 Top Cooling zone.
Reflow ovens
HELLER Industries

HANDEX
Machine with a revolutionary twin PCB rotary table transport system which allows simultaneous load/unload during operation. Designed for medium production volumes and offers great flexibility. The PCB carrier has a max. work area of 457mm x 508mm.
Selective soldering
Pillarhouse

SPS Smart Profiler
A smart device built with the Latest Data Processing and Wireless Technologies available. SPS can help you to reduce your production cost, improve quality and share data conveniently. The hardware is the best in temperature tolerance design using an LCP (Liquid Crystal Polymer) enclosure for better protection and faster cool down between profiles. You can connect 7, 9 or 12 Thermocouples.
Thermal profilling
KIC

Complete rework station RMSE
RMSE Station, equipped with MSE Module, ensures efficient and precise solder removal with its powerful suction system. It provides the fastest and safest solution for soldering and rework, including hot air applications.
Soldering and rework stations
JBC
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News
Reducing Workload and Retaining Expertise with AI Inspection
AI Judgement Station applications can learn from the best human inspectors and support the less experienced, becoming both an automation solution and a consultant to elevate overall inspection performance.
YAMAHA
5/5/2026
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Yamaha reveals latest updates boosting ease of use in 1 STOP SMART SOLUTION
Yamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection. With the latest version of the YSUP-PG programming module, users can quickly get optimized programs without the need for producing test assemblies to verify correct settings. Working from standard data sources such as the PCB gerber file, assembly CAD data, and component libraries, YSUP-PG generates programs for each machine. With optimized settings and all necessary corrections automatically applied, program generation accelerates the beginning of production.
YAMAHA
2/4/2025
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Boosting Surface-Mount Productivity with Autonomous Troubleshooting
Empowering component mounters to monitor their own performance and detect anomalies in real time allows production to handle faults and unexpected events. By preventing minor issues from escalating into costly downtime, production can continue without halting and engineers can diagnose and fix any underlying problems at a suitable time. This can help reduce operational disruptions and improve overall equipment effectiveness (OEE), ultimately leading to greater productivity.
YAMAHA
18/3/2025
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