MENISCO ST88 NEO
MENISCO ST88 NEO provides not only control but also design and investigation possibilities for the production process.
- Dipping speed 0,1-50mm/s by step of 0,1 mm/s
- Immersion depth 0.01-15mm by step of 0.01 mm
- Dwell time 3 to 120 s (more on demand)
- Max. net component weight 35 g
- Solder bath diameter 80 mm
- Solder bath capacity 2 kg
- Globule size (mm) 1, 2, 3.2 and 4mm
- Temperature setting range 0-450°C
- Temperature controlling accuracy + /- 1 ° (standard request 3°C)
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